Graduate Certificate in Electronic Packaging Courses

ENME690 – Mechanical Fundamentals of Electronic Systems

An understanding of the fundamental mechanical principles used in design of electronic devices and their integration into electronic systems will be provided. Focus will be placed on the effect of materials compatibility, thermal stress, mechanical stress, and environmental exposure on product performance, durability and cost. Both electronic devices and package assemblies will be considered. Analysis of package assemblies to understand thermal and mechanical stress effects will be emphasized through student projects.

ENME695 – Failure Mechanisms and Reliability
This course will present classical reliability concepts and definitions based on statistical analysis of observed failure distributions. Techniques to improve reliability, based on the study of root-cause failure mechanisms, will be presented; based on knowledge of the life-cycle load profile, product architecture and material properties. Techniques to prevent operational failures through robust design and manufacturing practices will be discussed. Students will gain the fundamentals and skills in the field of reliability as it directly pertains to the design and the manufacture of electrical, mechanical, and electomechanical products.

and 2 of the following courses:

 

ENME737 – Prognostics and Health Management
Prognostics and health management (PHM) is an enabling discipline consisting of technologies and methods to assess the reliability of a product in its actual life cycle conditions to determine the advent of failure and mitigate system risk. PHM permits the reliability of a system to be evaluated and predicted in its actual application conditions. In recent years, prognostics and health management (PHM) has emerged as a key enabling technology to provide an early warning of failure; to forecast maintenance as needed; to reduce maintenance cycles; to assess the potential for life extensions; and to improve future designs and qualification methods. In future, PHM will enable systems to assess their own real-time performance (self-cognizant health management and diagnostics) under actual usage conditions and adaptively enhance life cycle sustainment with risk-mitigation actions that will virtually eliminate unplanned failures.

ENME770 – Life Cycle Cost and System Sustainment Analysis
This course melds elements of traditional engineering economics with manufacturing process modeling and life cycle cost management concepts to form a practical foundation for predicting the cost of commercial products. Methodologies for calculating the cost of systems will be presented. Product life cycle costs associated with scheduling design, reliability, design for environment (life cycle assessment), and end-of-life scenarios will be discussed. In addition, various manufacturing cost analysis methods will be presented, including process-flow, parametric, cost of ownership, and activity based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects will be considered. This course will use real life design scenarios from integrated circuit fabrication, electronic systems assembly, and substrate fabrication as examples of the applications of the methods mentioned above.

ENME780 – Mechanical Design of High Temperature and High Power Electronics
This course melds elements of traditional engineering economics with manufacturing process modeling and life cycle cost management concepts to form a practical foundation for predicting the cost of commercial products. Methodologies for calculating the cost of systems will be presented. Product life cycle costs associated with scheduling design, reliability, design for environment (life cycle assessment), and end-of-life scenarios will be discussed. In addition, various manufacturing cost analysis methods will be presented, including process-flow, parametric, cost of ownership, and activity based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects will be considered. This course will use real life design scenarios from integrated circuit fabrication, electronic systems assembly, and substrate fabrication as examples of the applications of the methods mentioned above.

ENRE600 – Fundamentals of Failure Mechanisms
Physical, chemical, and thermal related failures are introduced through a basic understanding of degradation mechanisms such as diffusion, electromigration, defects and defect migration. The failure mechanisms in basic material types will be taught. Failure mechanisms observed in real devices will also be presented. Problems related to manufacturing, and achieving quality and reliability will be analyzed. Mechanical failures are emphasized from the point of view of complex fatigue theory. The mathematical and statistical basis for analysis is presented as well as Failure Mode and Failure Analysis.

ENRE602 – Reliability Analysis
Principal methods of reliability analysis, including fault tree and reliability block diagrams; Failure Mode and Effects Analysis (FMEA); event tree construction and evaluation; reliability data collection and analysis; methods of modeling systems for reliability analysis. Focus on problems related to process industries, fossil-fueled power plant availability, and other systems of concern to engineers.

ENRE641 – Probabilistic Physics of Failure and Accelerated Testing

Prerequisites: ENRE 600 and ENRE 602, or permission of instructor. Models for life testing at constant stress. Graphical and analytical analysis methods. Test plans for accelerated testing. Competing failure modes and size effects. Models and data analyses for step and time varying stresses. Optimization of test plans.

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