Electronic Packaging

Electronics surround us – embedded in products ranging from health monitors and smart phones to electric cars and wind turbines.  This widespread incorporation of electronics into all manner of products has been driven by advanced integration and packaging technologies.  These packaging technologies govern the cost, size, weight, manufacturability, quality, and reliability of products and are often as important as device performance to their commercial success.  Advanced packaging is especially important in the most challenging applications of electronics, such as space exploration, autonomous electric vehicles, and renewable energy generation, where it is needed to withstand temperature extremes, shock/vibration, and high voltage.  It is also critical to new product areas such as flexible and wearable electronics. 

The University of Maryland is leveraging its unique strength in reliability along with its expertise in electrical engineering, mechanical engineering, materials science, and business to create a new on-line certificate in electronic packaging that will permit practicing engineers and non-traditional students to gain expertise in the technologies involved in the reliable integration and packaging of electronics.  Course topics include basics of electronic system integration, heat transfer, thermal management, stress analysis, cost analysis, quality and reliability assessment, and prognostics and health management.  This knowledge is invaluable for furthering careers in the avionics, automotive electronics, industrial motor drives, military electronics, and medical equipment industries, among many others. 

 

 

For more information contact:
 

F. Patrick McCluskey, Ph.D.
Professor and Leader, Electronic Products and Systems Division
Department of Mechanical Engineering
University of Maryland, College Park, MD 20742
E-mail: mcclupa@umd.edu
 

Admission Requirements

 

Full admission as a degree seeking student requires the following:

  • A bachelor's degree, with a GPA of 3.0 or better, in engineering from an accredited institution
  • Courses in mathematics (Calculus I, II, III, & Differential Equations) are required to be considered for admission.
  • Courses in Thermodynamics, Fluid Mechanics, Heat Transfer, and Structural mechanics (equivalent of ENES220) are recommended to be considered for admission.
  • Two letters of recommendation are required for the GCEN Program if the GPA is slightly below 3.0.

Office of Advanced Engineering Education

2105 J.M. Patterson Building
University of Maryland
College Park, MD 20742

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